3rd Space Passive Component Day, SPCD, 9-12 October 2018, Noordwijk, The Netherlands
Assessment on using Solderless Assembly for Electronics in Space Applications, authors: Ciprian Ionescu, Gaudenţiu Vărzaru, Mihai...
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24th International Symposium for Design and Technology in Electronic Packaging (SIITME), 25-28 Oct.
Syswin Solutions research team presented two papers: 1. Study of the Waterproof Shelter Colour Influence on the Atmospheric Temperature...
Lack of predictability makes you inventive every day!
Full article & video here: https://www.businessmagazin.ro/actualitate/adrian-zarnescu-cto-syswin-solutions-lipsa-predictibilitatii-te-fac...
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