During the 30th IEEE International Symposium for Design and Technology in Electronics Packaging event, SIITME 2024, that took place in Sibiu, October 16-19, 2024, Syswin Solutions presented the paper "Considerations regarding environmental testing of a solderless assembly for electronics module" by Gaudenţiu Vărzaru, Roxana Tulea, Bogdan Mihăilescu, Mihai Branzei and Paul Svasta. The work, which resulted from Syswin Solutions' collaboration in the COMPACT research project with the Center for Electronic Technology and Interconnection Techniques, CETTI, within the National University of Science and Technology Politehnica Bucharest and Tactica TIC (Spain), was appreciated by the Steering Committee with the Excellent Poster Award.
Sywin Solutions also participated in the Exhibition and Session dedicated to the Industry within the same event. At his stand there were discussions on his successful SysAgria and SYCPE projects. During the Industrial Session, the company Syswin Solutions was presented in plenary under the motto “We Deliver High-Performance IoT & M2M Solutions.”
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